Predictive modeling of board level shock-impact reliability of the HVQFN-family
نویسندگان
چکیده
A semi-empirical model is derived to predict the board level drop-impact lifetime of HVQFN-packages soldered on a printed circuit board. The strain that evolves in the soldered interconnections is evaluated by a finite element model and related to the experimentally determined lifetime. The result is a power law and it is compared to literature data. In addition, a measure for the strain on the board is obtained analytically and compared with the experimental data. Here, too, dependence in the form of a power law is found. The combination of both results strongly suggests a near-linear relationship between the strain in the solder and the strain in the board. 2009 Elsevier Ltd. All rights reserved.
منابع مشابه
High Accelerations Produced through Secondary Impact and Its Effect on Reliability of Printed Wiring Assemblies
Title of Thesis: HIGH ACCELERATIONS PRODUCED THROUGH SECONDARY IMPACT AND ITS EFFECT ON RELIABILITY OF PRINTED WIRING ASSEMBLIES Stuart Taylor Douglas, Master of Science, 2010 Thesis directed by: Professor Abhijit Dasgupta Department of Mechanical Engineering The focus of this thesis is the investigation of extremely high accelerations through secondary impact and its effect on reliability of p...
متن کاملThe Effectiveness of Monetary Policy in Africa: Modeling the Impact of Financial Inclusion
Abstract This study uses annual data over the period 2005-2014 and the Panel VECM approach to examine financial inclusion and monetary policy effectiveness in Africa. The study shows that financial inclusion and monetary policy effectiveness are linked by a set of long-run relationships. Policy reaction to the positive financial inclusion shock is not significant. Policy reaction to the posit...
متن کاملOn the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
In this work, the endurance behavior of a ball grid array package is determined at two different temperature cycle conditions: a thermal cycle test and a thermal shock test. The observed failure distributions and failure modes allow deriving a translation factor between the two test conditions. Finite element analyses are carried out to design a predictive simulation model for the fatigue lifet...
متن کاملThe Impact of Domestic and Foreign Monetary Policy on Iran\'s economy: Global Modeling
One of the striking features of the business cycles is the patterns of co-movement of output, inflation, interest rates, and real equity prices across countries. This paper empirically examines the effects of domestic and foreign monetary policies on Iranchr('39')s macroeconomic variables (including real production, inflation, short-term interest rate, and real exchange rate) using quarterly da...
متن کاملINVESTIGATION OF IMPACT RESPONSE OF Pb-FREE ASSEMBLIES AND COMPARISON OF DROP TEST WITH CYCLIC 4-POINT BEND
The popularity and miniaturization of handheld consumer electronic products such as cell phones, notebook computers, and PDAs has enhanced their probability of being subjected to shock loads; hence making impact reliability study an important area of research. The transition from tin-lead (Sn-Pb) to lead-free (Pb-free) solder has pressed the electronics industry to characterize formulate essent...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
- Microelectronics Reliability
دوره 50 شماره
صفحات -
تاریخ انتشار 2010